Chairs: Jeffery K. Cochran, Arizona State University
Javier Bonal, Lucent Technologies

The electronics industry is the largest basic industry in the USA. At current annual growth rates, it has been predicted that within a decade, electronics will be the biggest worldwide industry after agriculture. At the heart of this industry is the manufacturing of integrated circuts. The industry has traditionally had high tech products, processes and manufacturing methods, but until recently, sophisticated techniques have not been used to model semiconductor manufacturing operations. The National Technology Roadmap for Semiconductors identifies modeling and simulation as a critical need for factory integration. The SMOMS `01 conference intends to be a forum for international efforts to meet those needs.

E Resource Database
Rohana Abdullah, On Semiconductor, W. Malaysia

The Impact on Technology Acceleration on Semiconductor Equipment Suppliers
Dave Anderson, International SEMATECH, USA

Dynamics and Control of Supply Chains in Semiconductor Manufacturing
Benjamin Armbruster, Arizona State University, USA

Dealing With the Challenges of Modeling a Constant WIP Semiconductor Fab
James L. Berry,

Applications of Fluid Models to Semiconductor Fab Operations
Ron Billings, International SEMATECH, USA

Methodology for Wafer Fab Model Validation
Javier Bonal, Agere Systems, Spain

Object-Oriented Simulation Platform Construction for the Modeling of Virtual Fab by Using SiMPLE
I-Hui Chang, Piotech Co. Ltd., Taiwan

A Study of Due Date Control by Using TOC?s Aggregates Buffer Approach
Sheng-Hung Chang, Minghsin Institute of Technology

Optimizing Multi-Objective Production and Setting Daily Production Goals For a Wafer Fabrication Facility
Hung-Nan Chen, Motorola, USA

Analyzing the Repair Decisions in the Site Unbalance Problem of Semiconductor Test Machine
Chen-Fu Chien, National Tsing Hua University, Taiwan

Design of a Scheduling System with Application to Diffusion Process
You-In Choung, Samsung Electronics, Korea

The Design of Cycle Time Estimation Model for the Wafer Fabrication with Multiple-Priority Orders
S.H. Chung, National Chiao Tung University, Taiwan

Optimal Buffer Settings for Serial Systems
Guy L. Curry, Moonsu Lee, Texas A&M University, USA

Modeling the Cycle Time and Departure Process for a Single Server Workstation with Random Sized Batch Arrivals
Guy L. Curry, Don T. Phillips, Texas A&M University, USA

Optimal Opportunistic Maintenance Policies for Semiconductor Manufacturing
Esma Gel, Arizona State University, USA

Capacity Planning Under Uncertainty
Sarah Hood, IBM, USA

Multi-Functional Integrated Simulation Environment for Printed Circuit Board Production
Sachin Jain, University of Illinois at Urbana-Champaign, USA

A Virtual Cluster Tool Model for Cluster Tool Controller and Scheduler Development
Yong-Jae Joo, KAIST, Korea

Neff=1: An Efficient Method for Obtaining SPC Limits for Semiconductor Processing
Madhukar Joshi, Texas Instruments, USA

On the Uses of Simulation in the Planning and Ramp Phases of a High Volume Manufacturing FAB
Adar Kalir, Orion Avidan, Intel Corporation, Israel

A Hierarchical Scheduling Approach for Semiconductor Assembly Facilities
Heinrich Kuhn, Catholic University of Eichstaett, Germany

An Efficient Classification Method for Wafer Testing Using Principal Component Analysis and Mahalanobis Distance
Te-Sheng Li,

The Manufacture/Outsource Decision in Electronics Manufacturing
Scott Mason, University of Arkansas, USA

The Automated Simulation Validation System
Cabe Nicksic, Advanced Micro Devices, USA

The Design and Development of a Production Data Warehouse for IC Foundry
Der-Baau Perng, National Chiao Tung University, Taiwan

Investigating Benefits of Heterogeneous Implementation of Conservative Synchronization Policies in Large Scale Semiconductor Manufacturing Models
Igor Paprotny, Arizona State University, USA

CONWIP-like Lot Release for a Wafer Fabrication Facility with Product Mix Changes
Oliver Rose, Germany

Making Hot Hot Lots Hotter: Impact on System Stability
Kristin Rust, Sematech, USA

Reduction of Average Cycle Time at a Wafer Fabrication Facility
Subhash Sarin, Virginia Polytechnic Institute and State University, USA

Comparison of Dispatching Rules for a Large Semiconductor Manufacturing Facility
Alexander Schoemig, Infenion Technologies, Germany

An Intelligent Approach for Simultaneous Optimization of a BGA Wire Bonding Process
Tai-Lin Chiang,

A Look-Ahead AGV Control Procedure Considering Part and AGV Blocking for Semiconductor and LCD Production
Jungdae Suh,

Scheduling for a Flowshop of Two Batch Processing Machines with Due Date Related Measures Incorporated
Chang Sup Sung, Korea Advanced Institute of Science and Technology, Korea

Use Of Cluster Tool Modeling To Improve Throughput On CVD Tools
Keith Pare, Advanced Micro Devices, USA
 

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