Technical Program Committee A. Abonameh, University of Akron, USA J. Agrawal, University of Missouri-K.C., USA I. Akyildiz, Georgia Tech, USA K. Al-Tawil, KFUPM, Saudi Arabia R. Ammar, University of Connecticut, USA H. van As, Vienna University of Technology, Austria L. G. Birta, University of Ottawa, Canada N. Boudriga, University of Tunis, Tunisia A. Campbell, Columbia University, USA H. B. Diab, American University of Beirut, Beirut, Lebanon. A. K. Elmagarmed, Purdue University, USA L. Fratta, Politecnico di Milano, Italy G. Fodor, Ericsson Radio Systems, Sweden A. Ganz, University of Massachusetts, USA M. Gerla, UCLA, USA M. Guizani, Univ. of Missouri-Columbia / K.C., USA W. Hahn, University of Passau, Germany J. Harju, Tampere Univ. of Technology, Finland H. Hughes, Michigan State University, USA A. Jajszczyk, Cracow Univ.-Mining/Metallurgy, Poland G. Karlsson, KTH, Sweden D. Kazakos, University of Louisiana, USA H. Khalid, Motorola Inc., USA U. Killat, TU Hamburg-Harburg, Germany B. Kraimeche, Washington State University, USA K. Kwiat, Air Force Research Laboratory, USA T. Gon Kim, KAIST, Korea P. J. Kuehn, University of Stuttgart, Germany A. Lehmann, Univ. der Bundeswehr Muenchen, Germany L. Lenzini, University of Pisa, Italy M. T. Liu, Ohio State University, USA I. Mahgoub, Florida Atlantic University, USA K. Makki, University of Southwestern Louisiana, USA S. Makki, Queensland University of Technology, Australia X. Meng, University of Texas - Pan American, USA H. Mouftah, Queen's University, Canada F. Neri, Politecnico di Torino, Italy G. Pacifici, IBM T.J. Watson Res. Center, USA S. Palazzo, University of Catania, Italy G. I. Papadimitriou, Aristotle University, Greece A. Pattavina, Politecnico di Milano, Italy K. Pawlikowski, University of Canterbury, New Zealand G. Polyzos, UCSD, USA R. Puigjaner, Universitat de les Illes Balears, Spain V. Lagrange M. Reis, Compaq Computers Corp., USA G. Paolo Rossi, Universita` di Milano, Italy I. Rubin, UCLA, USA D. Schilling, CUNY, USA C. Tim Spracklen, Aberdeen University, UK T. Suda, UCI, USA P. Tran-Gia, University of Wuerzburg, Germany I. Toda, Fujutsu Laboratories Ltd., Japan K. S. Vastola, Rensselaer Polytechnic Institute, USA M. Veeraraghavan, Brooklyn Polytechnic University, USA M. Villen Altamirano, Telefonica, Spain