Call for Papers
2005 International Conference on Bond Graph Modeling and Simulation (ICBGM'05)

Part of the 2005 Western Simulation Multiconference (WesternSim'05)

Sponsored by:
The Society for Modeling and Simulation International (SCS)

January 23 - 27, 2005

Wyndham New Orleans at Canal Place Hotel
New Orleans, Louisiana, USA

The 2005 International Conference on Bond Graph Modeling and Simulation brings together research paper presentations, panel sessions, tutorials, workshops, seminars, industrial applications, and software demonstrations that use Bond Graph modeling methods. There will be also featured plenary speakers and some special invited presentations. This conference will focus on Bond Graph modeling techniques for dynamic systems. Theoretical principles for electrical, mechanical, hydraulic, pneumatic, and control system applications will be presented. Leading industrial users of the method in automotive, aircraft, fluid power, kinematics, multibody systems, and social and biological systems have been invited. Research papers are welcome in the following categories of presentation.

Sessions:

Tutorials
Panel Discussions
Software and Tools
Bond Graph Theory
Advanced Bond Graph Methodology 
Bond Graphs and Block Diagrams 
Computer Graphics and Bond Graph Modeling
Qualitative Modeling
Mechatronics Systems
Mechanical Systems and Robotics
Electrical and Power Systems
Control Systems
Thermal and Chemical Systems
Biomechanics and Prosthetics
Ecological Systems
Biological and Medical Systems
Social and Economic Systems
Industrial Applications
Large, Nonlinear Models

Key Dates

Short Abstracts due (two copies)     May 1, 2004
Notification of abstract acceptance to authors May 15, 2004
Full papers due for review (five copies) July 1, 2004
Notification of paper acceptance to authors September 1,2004
Camera Ready Copies due October 1, 2004

Original, high-quality technical papers are solicited for review, possible presentation, and subsequent publication in the conference proceedings. All final paper submissions are to be made electronically to SCS via the Manuscript Central proceedings management system. Include complete postal and e-mail addresses and fax and phone numbers of corresponding author. Papers must be in English. For further instructions, please refer to the Submission Instructions in the Manuscript Central web site. Confirmations will be sent to the contact author when the file has been retrieved and successfully viewed or printed. Authors should identify the area(s) in which they think their contribution would best fit. Authors must obtain any employer, client, or government clearances before submission of the final manuscript. All conference attendees participate at their own expense.

Abstracts and full papers can be submitted alternatively to the General Chair or the Program Chair. In addition to regular papers of about 12 pages (double spaced), the program committee may accept additional papers, either as short papers (about 6 pages double-spaced), or proposals for tutorials. Please add a cover letter stating your name, affiliation, mail address, telephone number, FAX number, and e-mail address. The short abstracts will be reviewed by the two Chairs for general suitability to the conference. Three members of the International Program Committee will review each full paper.

General Chair     Program Chair
Professor José J. Granda
Dept. of Mechanical Engineering
California State University, Sacramento
Sacramento, Calif. 95819
Phone: (916) 278-5711
FAX: (916) 278-7713
    Professor François E. Cellier
Dept. of Electrical and Computer Engineering
University of Arizona
Tucson, Arizona 85721-0104
Phone: (520) 621-6192
Fax: (520) 621-8076

International Program Committee

Wolfgang Borutzky, Rhein-Sieg University of Applied Sciences, Germany
Peter Breedveld, Tech. University of Twente, Netherlands
Forbes Brown, Lehigh University, U.S.A
Geneviève Dauphin, Ecole Centrale de Lille, France
Marisol Delgado, Universidad Simon Bolivar, Venezuela
Halvard Engja, Norwegian Institute of Technology (emeritus), Norway
Jesús Félez, Universidad Politécnica de Madrid, Spain
Peter Gawthrop, University of Glasgow, United Kingdom
Kamal Youcef-Toumi, Massachusetts Institute of Technology, U.S.A.
Sergio Junco, Universidad del Rosario, Argentina
Dean Karnopp, University of California, Davis, U.S.A.
Jaques Lefevre, University of Lille, France
Loucas Louca, University of Cyprus, Cyprus
Donald Margolis, University of California, Davis, U.S.A.
Amalendu Mukherjee, Indian Institute of Technology, India
Ray Montgomery, NASA (Emeritus), USA
Raul Longoria, University of Texas, Austin, U.S.A.
Ronald Rosenberg, Michigan State University, U.S.A.
Serge Scavarda, I.N.S.A. Lyon, France
Jacek Stecki, Monash University, Australia
Jeffrey L. Stein, University of Michigan, U.S.A.
Carlos Tersio, Correa da Silva Pontifical Catholic University of Rio de Janeiro, Brazil
Jean Thoma, Thoma Consulting, Zug, Switzerland
Jan Top, Agrotechnological Research Institute, Netherlands
Tong Zhou, California State University, Sacramento, U.S.A.

International Industrial Advisory Board

Frederic Brix, Imagine, France
Dominic Diston, British Aerospace, United Kingdom
Dietrich Sahm, Daimler-Chrysler, Germany
Davor Hrovat, Ford Motor Company, U.S.A
Joseph Juarez, Honeywell Corporation, U.S.A.
Mike Morris, Lockheed Martin Corporation, U.S.A
Jan-Erik Stromberg, Er Dst Control, AB, Sweden
Katsuya Suzuki, Toyota, Japan
Ashraf Zeid, Visteon Corporation., U.S.A

Sponsored by The Society for Modeling and Simulation International
P.O. Box 17900
San Diego, California 92177
Phone 858-277-3888
Fax 858-277-3930
E-mail scs@scs.org

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